Japanese PCB for Multi Chip Module(MCM)It is possible to supply PCB with single or multi cavities available for mounting multi bare chips and QFP on it by mixing our original processing technologies, such as precision multi-lamination technology, inner layer milling technology, STH technology, fine patterning technology, etc. In result, it enables to achieve multi-function and multi chip module PCB.

•KEY TECHNOLOGY

	FA & Robot	Automobile	Medical & Sensing	LED	Chip size Package	High Frequency Module	Chip on Board	BGA	Multi Chip Module
Inner Layer Milling Technology	A	B	A	B	A	A	A	A	A
High Dam Printing Technology	A	B	A	B	A	A	A	A	A
Laser via Technology	A	B	A	B	A	A	A	A	A
Stacking Technology	A	B	A	A	B	A	B	A	A
Electroless Soft Gold plating Technology	A	A	A	A	A	A	A	A	A
Pin Caulking Technology	B	B	A	B	B	A	B	A	B
Dry Film Tent on Via Technology	B	B	B	A	A	B	A	B	B
Punching Technology	B	B	B	A	B	A	B	B	A
Flat Push Back Technology	A	A	A	A	B	A	B	B	A

A=Delivered record /B=Possible

•CAPABILITIES

Panel size = 340x340mm

406x340mm

510x340mm

Thickness = 0.06-3.0mm

Material = Hitachi, Mitsubishi, Matsushita,

Risho, Kyocera, Rogers

Capacity = 10,000m²/month over

Products = Dual side PCB

Multi-layer PCB (3-16 layers)

Build-up PCB