Japanese PCB for High Frequency Devices

Location:
Okaya-shi, Japan
Status:
New
Sample Availibility:
yes
Payment Terms:
Cash, Bank Transfer, Letter of Credit, T/T, L/C

Product Description

Module PCB for High Frequency Devices
Specific processing technology is applied to the material and it enables to provide high
density, thinner dielectric PCB required for communication apparatus.

•KEY TECHNOLOGY

FA
&
Robot
AutomobileMedical
&
Sensing
LEDChip
size
Package
High
Frequency
Module
Chip
on
Board
BGAMulti
Chip
Module
Inner Layer Milling TechnologyABABAAAAA
High Dam Printing TechnologyABABAAAAA
Laser via TechnologyABABAAAAA
Stacking TechnologyABAABABAA
Electroless Soft Gold plating TechnologyAAAAAAAAA
Pin Caulking TechnologyBBABBABAB
Dry Film Tent on Via TechnologyBBBAABABB
Punching TechnologyBBBABABBA
Flat Push Back TechnologyAAAABABBA

•CAPABILITIES

Panel size = 340x340mm

406x340mm

510x340mm

Thickness = 0.06-3.0mm

Material = Hitachi, Mitsubishi, Matsushita,

Risho, Kyocera, Rogers

Capacity = 10,000m²/month over

Products = Dual side PCB

Multi-layer PCB (3-16 layers)

Build-up PCB



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Contact Information

Company:
 NIHON MICRON CO.,LTD.
Phone Number:
  81-266-238373
Fax Number:
 81