Cavity Package for electronic data systems

Location:
Yixing, China ( Mainland)
Status:
New
Sample Availibility:
yes
Payment Terms:
Cash, Bank Transfer, Letter of Credit, T/T, L/C

Product Description

♥ We can design and modify according to customer needs !

♥ Our Website: http://www.yxjtdz.com/en/index.asp (English Version)

http://www.yxjtdz.com/index.asp (Chinese Version)

♥ Tips: Pls Copy and paste into the address bar

♦ Product Name

Hermetic housings

♦ Specifications:

1.Application areas:All kinds of hybrid thick flim and thin-flim integrated circuits package,suitable for plug-in assembly.

2.Material:4J29(FeNiCo) alloy.
3.Surface plating:Ni/Au plating, selective Au plating.

♦ Technical requirements:

1.All of the property index should conform to the requirements of GJB2440A<<General Standard of Hybrid Integrated Circuit Package>>
2.Remove all burrs and sharp edges.
3.Finish:Au thickness ≥1µm,≤5.7µm,Ni thickness 1.3µm-14.43µm
4.RoSH

♦ Main Drawings (part)

MDIP3529-P24P

MDIP1616-P8P

MDIP2009-P8P

MDIP2119-P12P

MDIP2212-P16P

MDIP2213-P14P

MDIP2314-P14P

MDIP2513-P14P

MDIP2713-P6P

MDIP3116-P10P

MDIP3222-P4P

MDIP3320-P10P

MDIP3320-P24P

MDIP3524-P20P

MDIP3529-P24P



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Contact Information

Company:
 Yixing City Jitai Electronics Co., Ltd.
Phone Number:
  0086-0510-87188891
Fax Number:
 0086-0510-87188295