Files

Gerber, Protel, Powerpcb, Autocad, Orcad, etc

Material

FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)

Layer No.

1 - 12 Layers

Board thickness

0.015"(0.4mm)-0.125"(3.2mm)

Board Thickness Tolerance

±10%

Copper thickness

0.5OZ - 3OZ

Impedance Control

±10%

Warpage

0.075%-1.5%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Min Trace Width (a)

0.005"(0.125mm)

Min Space Width (b)

0.005"(0.125mm)

Min Annular Ring

0.005"(0.125mm)

SMD Pitch (a)

0.012"(0.3mm)

pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)

0.027"(0.675mm)

Regesiter torlerance

0.05mm

Min Solder Mask Dam (a)

0.005"(0.125mm)

Soldermask Clearance (b)

0.005"(0.125mm)

Min SMT Pad spacing (c)

0.004"(0.1mm)

Solder Mask Thickness

0.0007"(0.018mm)

Hole size

0.01"(0.25mm)-- 0.257"(6.5mm)

Hole Size Tol (+/-)

±0.003"(±0.0762mm)

Aspect Ratio

06:01

Hole Registration

0.004"(0.1mm)

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel 3-7um Au:1-3u''

OSP

0.2-0.5um

Panel Outline Tol (+/-)

±0.004''(±0.1mm)

Beveling

30°45°

V-cut

15° 30° 45° 60°

Surface finish

HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion Tin, OSP,

Certificate

ROHS ISO9001:2008 TS16949 SGS UL

Special requirements

Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger

Layers

Sample

First Order

Repeat Order

Single side

3 days

7 days

6 days

Double side

4 days

8 days

7 days

4 Layer

7 days

9 days

8 days

6 Layer

8 days

10 days

9 days

8 Layer

10 days

12 days

10 days

10 Layer

12 days

14 days

12 days

Alu-base

3 days

8 days

7 days