Surface Mount Assembly

Each assembly is profiled thermally prior to production; ensuring the reflow process adheres to both solder manufacturer and customer’s specifications.

We are capable of placing a wide range of standard and odd-form SMDs, from the smallest 0201 devices through CSPs, μBGAs, flip-chips and other components up to 38 mm x 38 mm, including 0.5 mm (20 mil) fine-pitch BGAs.
Maximum PCB size is 1200mm * 240mm
e.g. LED Tube,LED Bar.

Pin Through Hole

Capabilities to place tape and reeled radial components sizes. Maximum PCB size is 25" x 25". Placement rates reach 5000 pieces per hour with an accuracy of 99% minimizing component loss.

Chip on Board
Our COB packaging product line was put into production in October of 2004. Hongtai imported 12 sets of ASM-AB530 automatic ultrasonic & golden ball wire bonders, & automatic high precise die attaching machines which under our strict quality control, are used in our advanced clean room. serving hundreds of companies with high - quality COB packaging services, and bonding products such as remote control devices, keyboards, mice, MP3’s, smartcards, flash memory, medical equipments and more. We can produce 2000K COB packages monthly .

Board and System Level Testing

AOI Testing

·Checks for solder paste

·Checks for components down to 0201"

·Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection

X-Ray provides high-resolution inspection of:

·BGAs

·Micro BGAs

·Chip scale packages

·Bare boards

In-Circuit Testing

In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.

·Power-up Test

·Advanced Function Test

·Flash Device Programming

·Functional testing