Professional Circuits Design/ Modification/ Processing,

PCB schematic capture/design/layout/prototype/Fab/PCB assembly ODM/OEM services offered.

Specifications,

Electronic design service, we also offer contract turnkey manufacturing & design with one-stop ServiceContract manufacturing service Applicable in industrial, automotive, computing, storage, consumer, instrumentation, medical, networking, peripherals and telecommunicationsComplete products contract PCB assembly and manufacturing serviceCircuit boards: 1 - 22 layers PCB layout, fabrication and PCB assembly and box buildActive/passive components are sourced directly from original manufacturers We provide an extensive range of fabrication, engineering and machining services, including vertically integrated high precision SMT mount, plastic injection molding, high volume metal stamping, die-casting and custom fabrication.Enclosure cabinet case: plastic injection molding, metal stamping, manufacture and assemblyTesting: PCBA in-circuit testing (agilent), PCBA function testing (Agilent), AOI (omron), X-Ray inspection

Product	Single sided to 22 layers PCB
Material	FR1, FR2, CEM1, CEM3, FR4, BT
Board thickness	0.2mm to 7mm
Base copper	0.5oz to 7oz
Min. hole size	0.15mm
Min LW/LS	0.075mm(Flash Gold)/0.15mm(HASL)
Aspect ratio	1:06
Soldermask	LPI type, Baked type, Peelable mask
Surface finishing	HASL, Flash gold, Immersion gold, Gold finger, Carbon ink
Max. panel size	508mm x 610mm
Bow & twist	0.7% (1.5mm board)
Hole size tol.	PTH: +/-0.08mm, NPTH: +/-0.05mm
Hole location tol.	+/-0.05mm
Gold thickness	0.05um to 1.5um
Nickel thickness	1um to 5um

Workflow

Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

PCBA Touchups

(1) Objectives

Producing PCBA control panels by following PCB diagrams, component checklists, burning processes and testing methodologies provided by clients.

(2) Specifications

can accommodate chips components containing 0402 and above and high-precision components such as BGA etc.

chip speed of 0.015S/ chips, chip precision ≥0.01 mm

(3) Output capacity

2 Fujistu high speed chip production lines consist of 1 automated printer, 2 high speed chip machines, 1 multi-purpose chip machine and 1 reflow machine. Daily output of 120,000 chips

We look forward to receiving your enquiries soon.