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HIGH Power LED COB and chips molding sealant silicone coated led strips

Location:
yiwuChina (, Mainland)
Status:
New
Sample Availibility:
yes
Payment Terms:
Cash, Bank Transfer, Letter of Credit, T/T, L/C
Categories:
Home > Chemicals > Adhesives & Sealants

Product Description

HIGH Power LED COB and chips molding sealant silicone coated led strips

Description

G3150A/B is a bi-component additive type silicone gel solventless and high purity, when part A and part B are mixed and cured, the product features high electrical resistivity and good resistance of moisture, yellowing, ageing and cold heat cycle. The cured product is colorless and transparent, high adhesion and sealing to PPA and metals. Good performance of non-cracking, non-hardening, high optical transmittance, high refractive and thermal stability.

Application

Applied in high Power LED phosphor,COB,chips and molding sealant

Data Sheet:(hardness and viscosity can fit as your detail requirement,thank you!

Use

model

LED phosphor gel

LED phosphor gel

For chips and COB

COB and molding sealant

Little chip sealant

chips sealant

chips sealant

remark

G3150

G3165

G5560

G5578

G5518

G5573

G3180

A/B viscosity(25°C)mPa·s

28000±1500/900±150

20000±1500/1300±150

4500±400/5000±400

5000±500/5000 ±500

2500±300/2800±300

5000±500/5000±500

5000±500/5000±500

25°C temperature test

A/B mix rate

1:1

1:1

1:2

1:4

1:2

1:2

1:4

Mixture viscosity

3800±300

3800±300

5000±400

5000±500

2700±300

5000±400

5000±500

25°Ctemperature test

Curing Condition

100°C/0.5h +150°C/1h

100°C/0.5h+ 150°C/2h

100°C/0.5h+150°C/2h

100°C/0.5h+150°C/3h

100°C/0.5h+150°C/3h

100°C/0.5h+150°C/3h

100°C/0.5h+150°C/3h

Refractive Index (%)

1.530~1.540

1.530~1.540

1.530~1.540

1.530~1.540

1.530~1.540

1.530~1.540

1.530~1.540

Transparency(450nm,1mm thick) %

>98

>98

>98

>98

>98

>98

>98

Hardness (25°C)

55±5 (A)

65±5 (A)

35±5 (D)

38±5 (D)

45±5 (D)

55±5 (D)

55±5 (D)

Directions for use:

1. A, B glue by weight than mixture stirring after 6 ~ 10 minutes, will warm up gum to 45 ~ 55 °C, and then put in vacuum box, high vacuum bubble 5 ~ 12 minutes.

2. Base material before the glue should be thoroughly cleaned and dried at 150 °C, to remove water, oil, dirt and other impurities, sealant after checking if all of them found that there are air bubbles should be increasing the heat curing.

3. Reference cure conditions: 100 °C baking 0.5 hours, 150 °C drying 3.0 hours.

4. After LED light cured, before a reflow soldering should be kept using seal save or vacuum packaging, to prevent moisture absorption.

5. A, B glue mixture must be finished use within 12 hours.

Package

Part A and Part B:Both 500g/Bottle

Storage and shelf life

Part A and Part B should be stored separately at or below 25°C (77°F) in a ventilating, dry, cool place indoor.

Shelf life shall meet 6months at 25°C.Containers should be kept tightly closed at all times to extend shelf life.

Use for:



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Contact Information

Company:
 Yiwu Zhongyu Mechanical Equipment Firm
Phone Number:
  86-579-85071175
Fax Number:
 
 
Yiwu Zhongyu Mechanical Equipment Firm
 Zhejiang , China FREE
 

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