Por-environment Epoxy Waterproof Material For LED Bar

Location:
shanghaiChina (, Mainland)
Status:
New
Sample Availibility:
yes
Payment Terms:
Cash, Bank Transfer, Letter of Credit, T/T, L/C

Product Description

Description:

uZR108 epoxy waterproof material is a room temperature/heating curing epoxy resin glue. ZR108 is used for design, protection of the potting need high strength or confidential electronic products.

uZR108 clear epoxy potting glue without heating can cure. 2:1 (weight ratio) completely mixed part A and part B, form protection in a period of curing time.

After curing glue has the following characteristics:

uAgainst moisture, dirt and other atmospheric composition

uHigh strength

uHas confidential role

uSolvents, no cure by-products

uHave stable mechanical and electrical properties between -45°C-120°C

Conventional performance:

test item

testing standard

unit

A

B

Outside view

visual inspection

---

Clear liquid

Clear liquid

viscosity

GB/10247-2008

mPa·s(25°C)

900-1300

200-400

density

GB/T 13354-92

g/cm3(25°C)

1.10

1.10

Operation process:

test item

unit

value

mixture ratio

weight ratio

100:50

mixture ratio

volume ratio

100:50

Mixed viscosity

mPa·s(25°C)

500-1000

Mixture density

g/cm3(25°C)

1.10

operation time

min(25°C)

30

curing time

°C/hr

80/1.5 or 25/10

Operation time is a quantity of cement with 100 g.

A, B two components in proportion to remove mixing ratio, mixing, vacuum suction bubble in operation period, remove the potting products to casting, such as potting product is too big, suggest points potting, then according to The Times curing(80°C/90min or 25°C/10hr)

Operation caution:

uAgent A place for a long time, maybe produce precipitation, mix part A and B access should be paid attention to save after sealing.

uMixing should pay attention to the same direction, otherwise, it will stir with too much bubble; Borders and the bottom of the container sizing material should also stir well, can appear otherwise stir caused by uneven local not curing phenomenon.

uCasting the product vacuum pumping, remove again bubble can improve after curing products comprehensive performance.

uTemperature is too low will lead to curing speed partial slow, heat cure advice; Potting thickness more than 2 cm above 80 °C not directly in the curing, lest cause explosive together.

uThis glue curing exothermic reaction, match the process as the quantity of cement can affect the operation, so the length of time with 100 g resin content of operation time is only a reference time.

Typical performance:

test item

testing standard

Unit

value

hardness

GB/T 531.1-2008

Shore D

80

conductivity factor

GB/T 20673-2006

μm/(m,°C)

44

expansion coefficient

GB/T 8810-2005

24h,25°C,%

<0.1

water absorption

GB/T 1693-2007

kV/mm(25°C)

>20

glass transition temperature

GB/T 1693-2007

(1MHz)(25°C)

0.014

dielectric strength

GB/T 1693-2007

(1MHz)(25°C)

3.53

Loss factor

GB/T 1692-92

(DC500V)Ω· cm

1.2×1015

Remark:All the above data come from 25 °C and 55% RH glue curing conditions after 7 days.

Packing:

30 kg/set; 7.5kg/set; 1.5kg/set

Storage and transportation:

uPart A and part B need to avoid light, heat, save after sealed. (Can be used as the non-dangerous goods transport and storage)

uShelf life Agent A: 1 year, Agent B: 6 months(25°C)



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Contact Information

Company:
 Shanghai Jorle Fine Chem. Co., Ltd.
Phone Number:
  86-021-51872995
Fax Number:
 86-021-51872995-802