PCB assembly,PCBA,SMT,DIP process.

Technical requirement:

1) Surface-mounting Technology(SMT) and Through-hole/DIP

2) 0201,0402,0603 size components SMT technology and lead free technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) UL,CE,FCC,Rohs standard

5) With IPC-610D manufacturing and other international standards.

6) Nitrogen gas reflow soldering technology for SMT.

7) High density interconnected board placement technology capacity.

Others requirement:

1) Capable of developing effective production process to ensure high quality.ensure product quality and reliability.

2) Meets the international environmental protection requirement.

3) Complicated boards and components are available.

4) Provides OEM services to all sorts of printed circuit board assemblies.

PCBA,PCB Assembly,SMT Assembly One-stop

OEM services provider PCB assembly and function test.

Experienced components sourcing team

Type of productions: SMT,DIP process

ICT test

Professional engineering staff to provide technical support

OEM services are welcome

PCB assembly,PCBA,SMT,DIP assembly

Profound knowledge of contract manufacturing services

Capable of developing effective production process to ensure high quality.

ISO 9001:2000

Factory located in China.