Files

Gerber, Protel, Powerpcb, Autocad, Orcad, etc

Material

FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium,

High frequency Material (Rogers, Teflon, Taconic)

Layer No.

1 - 20 Layers

Board thickness

0.0075"(0.2mm)-0.125"(3.2mm)

Board Thickness Tolerance

±10%

Copper thickness

0.5OZ - 4OZ

Impedance Control

±10%

Warpage

0.075%-1.5%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Min Trace Width (a)

0.005"(0.125mm)

Min Space Width (b)

0.005"(0.125mm)

Min Annular Ring

0.005"(0.125mm)

SMD Pitch (a)

0.012"(0.3mm)

pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)

0.027"(0.675mm)

Regesiter tolerance

0.05mm

Min Solder Mask Dam (a)

0.005"(0.125mm)

Soldermask Clearance (b)

0.005"(0.125mm)

Min SMT Pad spacing (c)

0.004"(0.1mm)

Solder Mask Thickness

0.0007"(0.018mm)

Hole size

0.01"(0.25mm)-- 0.257"(6.5mm)

Hole Size Tol (+/-)

±0.003"(±0.0762mm)

Aspect Ratio

6:01

Hole Registration

0.004"(0.1mm)

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel 3-7um Au:1-3u''

OSP

0.2-0.5um

Panel Outline Tol (+/-)

±0.004''(±0.1mm)

Beveling

30°45°

V-cut

15° 30° 45° 60°

Surface finish

HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger,

immersion silver, immersion Tin, OSP, Carbon ink,

Certificate

ROHS ISO9001:2000 TS16949 SGS UL

Special requirements

Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger