OMAP Board PCBA

Location:
Shenzhen, China ( Mainland)
Status:
New
Sample Availibility:
yes
Payment Terms:
Cash, Bank Transfer, Letter of Credit, T/T, L/C

Product Description

PCB Assembly products field:

Industrial control

Alarm products

Measurement device

Telecom audio and video

Consumer electronics

Business Scope:
1. Bare Board Fabrication
2. Full Component Procurement
3. SMT/BGA/DIP Assembly
4. Inspection/Function Test of Finished Goods
5. Shipment Arrangement
PCB Assembly Competence:

1. Stencil size/range: 736*736mm

2. Minimum IC pitch:0.30mm
3. Maximum PCB size: 410*360mm
4. Minimum PCB thickness:0.35mm
5. Minimum chip size:0201
6. Maximum BGA size:74*74mm
7. BGA ball pitch: 1.00mm(min), 3.00mm(max)
8. BGA ball diameter:0.4mm(min), 1.0mm(max)
9. QFP lead pitch: 0.38mm(min), 2.54mm(max)
10.Frequency of stencil cleaning: 1 time/5 to 10 pieces
PCBA Equipment:
1. JUKI 2050, JUKI 2020, JUKI760 and JUKI 7502---3 automated manufacturing SMT lines
2. 1 Wave Soldering Line(supporting Rohs products)
3. 2 Hand Manual Soldering Lines for DIP(supporting Rohs products)
4. 3 Semi-automatic Printers(FSP-2015P, SP-3040A)
Requested Infomation for Assembly:
1. Gerber files or Protell 99 of the bare PC board, Bill of Material for assembly;
2. Testing guide;
3. To short the leadtime, pls kindly advise us if there is any acceptable components substitution.


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Contact Information

Company:
 Shenzhen Oriental FastAssembly Electronic Co., Ltd.
Phone Number:
  86-0755-28793260
Fax Number:
 86-0755-28794293