OEM/ODM pcb assembly process

Location:
Shenzhen, China ( Mainland)
Status:
New
Sample Availibility:
yes
Payment Terms:
Cash, Bank Transfer, Letter of Credit, T/T, L/C

Product Description

Our manufacturing is very flexible, and can meet needs as varied as small volume 2-layer prototypes, up to huge volume 20-layer mass productions. Provides OEM services to all kinds of PCBA as well as electronic encased products

PCB Performance:

·Blind and Buried via PCB
·Immersion gold plating PCB
·High frequency PCB
·High TG (170C) PCB
·Free halogen PCB
·Impedance control PCB
·Different PCB surface finish: HAL, Flash gold, Immersion gold
·Colorful solder mask PCB
·PCB Bwith Bridge Connecting
·RoHS

Our PCB fabrication capacity:

NO

Item

Craft Capacity

1

Layer

1-30 Layers

2

Base Material for PCB

FR4, CEM-1, Aluminium,TEFLON, , Halogen-free…

3

Rang of finish baords Thickness

0.21-7.0mm

4

Max size of finish board

900*900MM

5

Minimum Linewidth

0.1mm

6

Minimum Line space

0.1mm

7

Min space between pad to pad

0.1mm

8

Minimum hole diameter

0.1mm

9

Min bonding pad diameter

10mil

10

Max proportion of drilling hole and board thickness

1:12.5

11

Minimum linewidth of Idents

4mil

12

Min Height of Idents

25mil

13

Minimun thickness of soldermask

10um

14

Sodermask color

green, black, blue, white, yellow, purple, and matt, etc

15

E-Testing

100% E-Testing (High Voltage Testing); Flying Probe Testing

16

Special technological requirement

Blind & Buried Vias and High Thickness copper

17

Thickness of Copper

0.5-14oz (18-490um)

We provide you PCB product with high quality you can trust.We offer 100% quality warrantee,

shipping lead time guarantee and lower price guarantee for all over the world.

Quotation requirement

*Gerber file and BOM

*Clear photos of pcba or pcba sample deliver to us

.



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Contact Information

Company:
 Shenzhen Ridecon Technology Co., Ltd.
Phone Number:
  0086-755-28398048
Fax Number:
 0086-755-28398049