BGA solder ball 25000 grains / bottle have a lead solder ball

Location:
Shenzhen, China ( Mainland)
Status:
New
Sample Availibility:
yes
Payment Terms:
Cash, Bank Transfer, Letter of Credit, T/T, L/C

Product Description

Product name: BGA solder ball 25000 grains / bottle have a lead solder ball

11 kinds of specifications of choose and buy a bottle of 250000 grain (this product is absolutely then vow, some of them are less than the number of)
0.2 mm / 0.25 mm / 0.3 mm / 0.35 mm / 0.4 mm / 0.45 mm / 0.5 mm / 0.55 mm / 0.6 mm / 0.65 mm / 0.7 mm / 0.8 mm
Arbitrage in 11 is more favorable!
The role of beads:
Main connection beads semiconductor chips and circuit template and PCB, send electronic signals of beads type tin electronic parts. IC packaging tin bead diameter from 0.15 mm to 0.15 mm




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Contact Information

Company:
 Shenzhen Scintilla Import & Export Co., Ltd.
Phone Number:
  86-0755-89374826
Fax Number:
 86-0755-89374826