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0.76 0.76 mm 0.76mmLead Free Solder ball reballing rework BGA ball 25K 25 000 25000 96.5Sn/3Ag/0.5Cu

Location:
Hong, Kong Hong
Status:
New
Sample Availibility:
yes
Payment Terms:
Cash, Bank Transfer, Letter of Credit, T/T, L/C
Categories:
Home > Industrial Supplies > Welding & Solders

Product Description

0.76 0.76 mm 0.76mmLead Free Solder ball reballing rework BGA ball 25K 25 000 25000 96.5Sn/3Ag/0.5Cu

Diameters Tolerance & Spheroid Tolerance

Diameters

Diameters Tolerance

0.76mm(30mils)

±0.015 mm (± 0.6mils)

0.65mm(25mils)

±0.015 mm (± 0.6mils)

0.60mm(24mils)

±0.010 mm (± 0.4mils)

0.50mm(20mils)

±0.010 mm (± 0.4mils)

0.45mm(18mils)

±0.010 mm (± 0.4mils)

0.40mm(16mils)

±0.010 mm (± 0.4mils)

0.35mm(14mils)

±0.010 mm (± 0.4mils)

0.30mm(12mils)

±0.010 mm (± 0.4mils)

0.25mm(10mils)

±0.010 mm (± 0.4mils)

0.20mm(8mils)

±0.010 mm (± 0.4mils)

0.15mm(6mils)

±0.005 mm (± 0.2mils)

0.10mm(4mils)

±0.005 mm (± 0.2mils)

0.075mm(3mils)

±0.005 mm (± 0.2mils)

Note: If your requirements is different from those specified in the display, please informs us of the detail specification. We can usually meet your requirements.

Standard Package
The following is a standard shipping packaging, if customer has specific needs, the shipping packaging can change according to customer specification.

Diameters

Qty / Bottle

Qty / Carton

Carton Dimension

0.76mm ( 30 mils)

250kpcs

5kk pcs

395(W) x 275 (L)
x 105(H)mm

0.65mm ( 25 mils)

250kpcs

0.60mm ( 24 mils)

250kpcs

0.50mm ( 20 mils)

500kpcs

10kk pcs

0.45mm ( 18 mils)

1000kpcs

20kk pcs

0.40mm ( 16 mils)

1000kpcs

0.35mm ( 14 mils)

1000kpcs

0.30mm ( 12 mils)

1000kpcs

35kk pcs

0.25mm ( 10 mils)

1000kpcs

0.20mm ( 8 mils)

1000kpcs

0.15mm ( 6 mils)

1000kpcs

0.10mm ( 4 mils)

1000kpcs

0.075mm ( 3 mils)

1000kpcs

Solder spheres are packaged in ESD containers with a desiccant and fill in inert Nitrogen.

Storage and Handling

Clean and dry environments are required for solder spheres storage.

Probing of solder spheres in containers with fingers or other implements can damage the solder spheres by changing its shape, scoring its surface or contaminating its surface by skin oils.
The guarantee of shelf life of solder ball is 1 year (12 months) when solder balls are stored under unopened bottles and pointed storage condition as following.

Products are stored in environment below.

Temperature : 25 +/- 10 °C

Humidity : <65 %RH

Reflow Profile

Recommend reflow profile is as below. In order to optimize the process for your specific application, experimentation is recommended.

TIN LEAD TYPE

Tin Lead Assemble

Average Ramp Up Rate

3°C/second max

Preheat Temperature

100°C~ 150°C

Preheat Time

60~120 Seconds

Peak Temperature

220°C~ 225°C

Time within 5°C of actual Peak temperature

10~30 Seconds

Ramp Down Rate

6 °C/second max

Time 25°C to Peak Temperature

6 minutes max

LEAD-FREE TYPE

Lead-Free Assemble

Average Ramp Up Rate

3°C/second max

Preheat Temperature

150°C~200°C

Preheat Time

60~180 Seconds

Peak Temperature

245°C~260°C

Time within 5 °C of actual Peak temperature

20~40 Seconds

Ramp Down Rate

6°C/second max.

Time 25 °C to Peak Temperature

8 minutes max



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Contact Information

Company:
 Shenzhen Green Electronics Co., Ltd.
Phone Number:
  86-755-82733376
Fax Number:
 86-755-82132251
 
Shenzhen Green Electronics Co., Ltd.
 , Hong Kong SAR FREE
 

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