Economical Touch Screen 3 Heaters Infrared BGA Welding Machine Soldering and Desoldering BGA

Technology Parameter

Style NO.	WDS-450S
Maximum PCB size	L550*W500mm
PCB thickness	0.5~2.5 mm
Chips apply	1*1~70*70mm
Chip minimum space apply	0.15mm
PCB locating way	Fixture located
Temperature controlling way	K-tape thermocouple, closed loop control
Lower hot air heating	Hot air 800W
Upper hot air heating	Hot air 800W
Bottom pre-heating	IR 2700W
Power applies	Single phase: 220V, 50/60 Hz
Machine size	L620*W640*H600mm
Machine weight	Approx60KG

More Details Picture:

Features

High quality heating material ensures desoldering and soldering procedures of BGA are precisely controlled;Auto-generated profile, no need to adjust or change temperature on the profile;Adjustable Air flow and temperature within a wide range to produce high temperature breeze;Movable lower heating zone for easy operationTouch screen interface; 3 heaters; real-time temperature curve display on touch screen;Embeded industrial computer, PLC control; able to disply set profile and testing profile at the same time; analyze the profile,compared with saved history profiles;8 segments of temperature up(down) and 8 segments constant temperature control, unlimited profiles saving;Up/down adjustable lower hot air nozzle;Buzz after soldering or desoldering is finished;With different alloy hot gas nozzles, easy to replace.It could be tailored as per the specific requirements.The whole bottom IR preheating area can move along with X axis, so as to meet the need of different BGA repair and bigger size PCB

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